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Aluminum Nitride Substrate
Aluminum Nitride ceramic substrate has a thermal conductivity more than 170 W/m-K and high electrical resistivity, the new material is gaining more and more application in semiconductor and electronic industries.
For other tailor made dimensions, please contact us for quote with cost and lead time.
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Item
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Unit
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Type
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AN-170
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AN-200
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Dimension
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inch
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2x2/4x4/6x6/8x8,12"×12" (max)
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6"×6" (max)
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Thickness
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mm
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0.385/0.635/1.0/1.2
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0.385≦ t ≦1.5
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10.0 (max)
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Through hole
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mm
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≧φ0.1
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≧φ0.1
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Density
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g/cm3
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3.3-3.35
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3.33-3.36
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Thermal Conductivity
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W/(m.k)）
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170-190
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＞200
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